Products
Durable Dielectric Molding Compounds

SolEpoxy continues to innovate thermoset epoxy formulations to achieve new standards of toughness, impact strength, and moisture resistance. Our molding compounds are an excellent choice for the most challenging environments where electrical devices are subject to corrosives, chemicals, heat and shock.

We have also developed "green" formulations with low thermoset temperatures and fast cure rates to lower the cost of molding.

Strengths: Moldability, Dielectric Strength, Temperature Stability, & "Green" Flame Retardants

Unique Characteristics Products
Typical Applications Technical Data Sheets
Methods of Molding Material Safety Data Sheets
Unique Characteristics

SolEpoxy molding compounds are engineered for high glass transition temperature (Tg), and fire rated formulations are also available. Our molding compound products are characterized by:

  • Excellent Electrical Insulation
  • High Strength
  • Excellent thermal shock resistance
  • Meet and exceed automotive solvent resistance
  • Easy molding characteristics
  • Meet high temperature requirements - Class H and greater
  • Capability to provide a range of thermal conductivity properties
Typical Applications
Solenoid Coils  
High Voltage Equipment Bushings    
Sensors for Automotive and Proximity    
Actuators    
Reed Relays    
Electric Motors    
Products
  • Sensor Grade Molding Powders
MH20-01
High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
MG33F-0588
Gold color, low CTE, fast cure, high performance material with low stress, good mold release.
MG33F-0602
Black color, long flow, high performance material with low stress, good mold release.
  • Solenoid Coil Grade
MH20-01
High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
GR2620
High thermal conductivity and high Tg, with superior moldability.
MH6-0508NF
High toughness and high flexibility as well as superior moldability.
MH6-0504
Excellent crack resistance, good moldability, tough, flexible and high strength.
  • Bushing Grade
MG6-0330
Tough and flexible with high strength, designed specifically for bushings of all sizes.
  • Actuator Grade
MH20-01
High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
GR2620
High thermal conductivity and high Tg, with superior moldability.
  • Modules, Inductors, and Passive Electronic Devices
MG33-0690
Black, Low CTE, high performance material with low stress, good mold release, good adhesion to copper.
MG33F-0588
Gold color, low CTE, fast cure, high performance material with low stress, good mold release.
GR2520
Black, lower CTE, Fast cure, High Tg, Low warpage, low stress, good mold release, good adhesion to copper.
MH20-01
High Tg, high tensile and flex strength - general purpose compound featuring superior moldability.
GR2620
High thermal conductivity and high Tg, with superior moldability.
Methods of Molding

SolEpoxy's molding powders are designed for the insulation and protection of electronic and electrical devices. They can be easily molded using the following methods:

  • Conventional Transfer Molding Presses : The compounds are designed to mold easily, free of defects and with minimal mold cleaning. Our molding compounds are available in pellet form and granular powder, depending on the customers usage, with little or no dusting.
  • Automold Transfer Molding : The compounds are designed for fast cycle time, easy molding, and minimal cleaning. They come in high quality pellet form designed to fit any automolding process.
  • Injection Molding : Our compounds are epoxy based thermosetting plastics. They are designed for ease of processing and good barrel life. The material comes in granular form.
Products
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